i ntegrated c ircuits d ivision www.ixysic.com ds-LCC120-r09 1 LCC120 1-form-c optomos ? relay e 3 pb part # description LCC120 8-pin dip (50/tube) LCC120s 8-pin surface mount (50/tube) LCC120str 8-pin surfact mount tape & reel (1000/reel) parameters ratings units blocking voltage 250 v p load current 170 ma rms / ma dc on-resistance (max) 20 ? applications features description ordering information ? telecommunications ? telecom switching ? tip/ring circuits ? modem switching (laptop, notebook, pocket size) ? hook switch ? dial pulsing ? ground start ? ringing injection ? instrumentation ? multiplexers ? data acquisition ? electronic switching ? i/o subsystems ? meters (watt-hour, water, gas) ? medical equipment?patient/equipment isolation ? security ? aerospace ? industrial controls ? 3750v rms input/output isolation ? 1-form-c solid state relay ? low drive power requirements (ttl/cmos compatible) ? high reliability ? arc-free with no snubbing circuits ? fcc compatible ? vde compatible ? no emi/rfi generation ? small 8-pin package ? machine insertable, wave solderable ? surface mount tape & reel versions available LCC120p is a 250v, 170ma, 20 ?? 1-form-c relay. it is ideal for applications focused on peak load current handling capablilities. this device is perfect for applications where a signal needs to be switched between two different lines. the small 8-lead package makes it an ideal space-saving replacement for a 1-form-c electromechanical relay (emr). switching characteristics for a form-c device approvals ? ul recognized component: file e76270 ? csa certified component: certificate # 1175739 ? en/iec 60950-1 certified component: tuv certificate b 09 07 49410 004 i f 10% 90% t on t off 10% 90% t on t off i load i load form-a form-b 1 2 3 4 do not use + control C control do not use 8 7 6 5 normally closed pole normally open pole ac/dc configuration pin configuration
i ntegrated c ircuits d ivision www.ixysic.com 2 r09 LCC120 absolute maximum ratings are stress ratings. stresses in excess of these ratings can cause permanent damage to the device. functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. absolute maximum ratings @ 25oc parameter min max unit blocking voltage - 250 v p reverse input voltage - 5 v input control current - 50 ma peak (10ms) - 1 a input power dissipation 1 - 150 mw total power dissipation 2 - 800 mw isolation voltage, input to output 3750 - v rms operating temperature -40 +85 oc storage temperature -40 +125 oc 1 derate linearly 1.33mw / oc. 2 derate linearly 6.67mw / oc. parameter conditions symbol min typ max units output characteristics load current continuous, ac/dc con? guration - i l - - 170 ma rms / ma dc peak t = 10ms i lpk -- 400 ma p on-resistance, ac/dc con? guration i l =170ma r on -1620 ? off-state leakage current v l =250v p i leak --1 a switching speeds turn-on i f =10ma, v l =10v t on --5 ms turn-off t off --5 output capacitance v l =50v, f=1mhz c out -50- pf input characteristics input control current to activate i l =170ma i f - - 10 ma input control current to deactivate - i f 0.4 0.7 - ma input voltage drop i f =10ma v f 0.9 1.2 1.4 v reverse input current v r =5v i r --10 ? a common characteristics capacitance, input to output - c i/o -3- pf electrical characteristics @ 25oc
i ntegrated c ircuits d ivision LCC120 www.ixysic.com 3 r09 *the performance data shown in the graphs above is typical of device performance. for guaranteed parameters not indicated in t he written specifications, please contact our application department. common performance data @25oc (unless otherwise noted)* form-a relay performance data @25oc (unless otherwise noted)* typical led forward voltage drop (n=50, i f =5ma) 35 30 25 20 15 10 5 0 1.17 1.19 1.21 1.23 1.25 led forward voltage drop (v) device count (n) typical led forward voltage drop vs. temperature temperature (oc) led forward voltage drop (v) 1.8 1.6 1.4 1.2 1.0 0.8 -40 -20 0 20 40 60 80 120 100 i f =50ma i f =30ma i f =20ma i f =10ma i f =5ma typical leakage vs. temperature measured across pins 5&6 or 7&8 temperature (oc) leakage ( p a) -40 0.016 0.014 0.012 0.010 0.008 0.006 0.004 0.002 0 -20 0 20 40 60 80 100 energy rating curve time load current (a) 10 p s 1.2 1.0 0.8 0.6 0.4 0.2 0 1ms 100 p s 100ms 1s 10ms 10s 100s form-a typical turn-on time (n=50, i f =10ma, i l =170ma dc ) 0.75 1.35 2.25 1.05 1.65 turn-on time (ms) device count (n) 25 20 15 10 5 0 1.95 form-a typical turn-off time (n=50, i f =10ma, i l =170ma dc ) 0.32 0.23 0.50 0.68 0.59 0.41 turn-off time (ms) device count (n) 25 20 15 10 5 0 form-a typical on-resistance distribution (n=50, i f =10ma, i l =170ma dc ) 35 30 25 20 15 10 5 0 8.5 9.1 9.7 10.3 8.8 9.4 10.0 on-resistance ( : ) device count (n) form-a typical i f for switch operation (n=50, i l =170ma dc ) 1.05 3.15 4.55 2.45 3.85 5.25 led current (ma) device count (n) 25 20 15 10 5 0 1.75 form-a typical i f for switch dropout (n=50, i l =170ma dc ) 25 20 15 10 5 0 1.75 3.15 4.55 1.05 2.45 3.85 5.25 led current (ma) device count (n) form-a typical blocking voltage distribution (n=50) 35 30 25 20 15 10 5 0 330 350 370 390 340 360 380 blocking voltage (v p ) device count (n)
i ntegrated c ircuits d ivision www.ixysic.com 4 r09 LCC120 *the performance data shown in the graphs above is typical of device performance. for guaranteed parameters not indicated in t he written specifications, please contact our application department. form-a relay performance data @25oc (unless otherwise noted)* form-a typical turn-on time vs. led forward current (i l =170ma dc ) led forward current (ma) turn-on time (ms) 0 5 1015202530354045 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 50 form-a typical i f for switch operation vs. temperature (i l =170ma dc ) temperature (oc) led current (ma) -40 6 5 4 3 2 1 0 -20 0 20 40 60 80 100 form-a typical turn-on time vs. temperature (i l =170ma dc ) temperature (oc) turn-on time (ms) -40 1.2 1.0 0.8 0.6 0.4 0.2 0 -20 0 20 40 60 80 100 i f =10ma i f =15ma i f =20ma form-a typical turn-off time vs. led forward current (i l =170ma dc ) led forward current (ma) turn-off time (ms) 0 5 1015202530354045 0.25 0.20 0.15 0.10 0.05 0 50 form-a typical i f for switch dropout vs. temperature (i l =170ma dc ) temperature (oc) led current (ma) -40 6 5 4 3 2 1 0 -20 0 20 40 60 80 100 form-a typical turn-off time vs. temperature (i f =10ma, i l =170ma dc ) temperature (oc) turn-off time (ms) -40 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -20 0 20 40 60 80 100 form-a typical on-resistance vs. temperature (i f =10ma, i l =170ma dc ) temperature (oc) on-resistance ( : ) -40 12 10 8 6 4 2 0 -20 0 20 40 60 80 100 form-a typical load current vs. load voltage (i f =10ma) load voltage (v) load current (ma) 150 100 50 0 -50 -100 -150 -3 -1 -2 0 1 2 3 form-a maximum load current vs. temperature temperature (oc) load current (ma) 250 200 150 100 50 0 -40 -20 0 20 40 60 80 120 100 i f =30ma i f =20ma i f =10ma form-a typical blocking voltage vs. temperature temperature (oc) blocking voltage (v p ) -40 350 345 340 335 330 325 320 315 310 305 -20 0 20 40 60 80 100
i ntegrated c ircuits d ivision LCC120 www.ixysic.com 5 r09 *the performance data shown in the graphs above is typical of device performance. for guaranteed parameters not indicated in t he written specifications, please contact our application department. form-b relay performance data @25oc (unless otherwise noted)* form-b typical turn-on time (n=50, i f =10ma, i l =170ma dc ) 0.25 0.45 0.65 0.35 0.55 0.75 turn-on time (ms) device count (n) 30 25 20 15 10 5 0 form-b typical turn-off time (n=50, i f =10ma, i l =170ma dc ) 1.0 1.8 2.6 2.2 1.4 0.6 turn-off time (ms) device count (n) 30 25 20 15 10 5 0 form-b typical on-resistance distribution (n=50, i f =10ma, i l =170ma dc ) 30 25 20 15 10 5 0 9.3 11.1 12.9 14.7 10.2 12.0 13.8 on-resistance ( : ) device count (n) form-b typical i f for switch operation (n=50, i l =170ma dc ) 30 25 20 15 10 5 0 2.0 1.2 2.8 4.4 6.0 3.6 led current (ma) device count (n) 5.2 form-b typical i f for switch dropout (n=50, i l =170ma dc ) 25 20 15 10 5 0 1.75 3.15 4.55 1.05 2.45 3.85 5.25 led current (ma) device count (n) form-b typical blocking voltage distribution (n=50) 30 25 20 15 10 5 0 263 297 331 365 280 314 348 blocking voltage (v p ) device count (n) form-b typical turn-on time vs.led forward current (i l =170ma dc ) led forward current (ma) turn-on time (ms) 0 5 1015202530354045 0.45 0.40 0.35 0.30 0.25 0.20 50 form-b typical i f for switch operation vs. temperature (i l =170ma dc ) temperature (oc) led current (ma) -40 6 5 4 3 2 1 0 -20 0 20 40 60 80 100 form-b typical turn-on time vs. temperature (i f =10ma, i l =170ma dc ) temperature (oc) turn-on time (ms) -40 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0 -20 0 20 40 60 80 100 form-b typical turn-off time vs. led forward current (i l =170ma dc ) led forward current (ma) turn-off time (ms) 0 5 1015202530354045 1.6 1.4 1.2 1.0 0.8 0.6 0.4 50 form-b typical i f for switch dropout vs. temperature (i l =170ma dc ) temperature (oc) led current (ma) -40 6 5 4 3 2 1 0 -20 0 20 40 60 80 100 form-b typical turn-off time vs. temperature (i l =170ma dc ) temperature (oc) turn-off time (ms) -40 2.5 2.0 1.5 1.0 0.5 0 -20 0 20 40 60 80 100 i f =10ma i f =15ma i f =20ma
i ntegrated c ircuits d ivision www.ixysic.com 6 r09 LCC120 *the performance data shown in the graphs above is typical of device performance. for guaranteed parameters not indicated in t he written specifications, please contact our application department. form-b relay performance data @25oc (unless otherwise noted)* form-b typical on-resistance vs. temperature (i f =10ma, i l =170ma dc ) temperature (oc) on-resistance ( : ) -40 60 50 40 30 20 10 0 -20 0 20 40 60 80 100 form-b typical load current vs. load voltage (i f =10ma) load voltage (v) load current (ma) 150 100 50 0 -50 -100 -150 -4 -2 -1 -3 1 3 4 2 0 form b maximum load current vs. temperature (i f =10ma) temperature (oc) load current (ma) 250 200 150 100 50 0 -40 -20 0 20 40 60 80 120 100 form-b typical blocking voltage vs. temperature temperature (oc) blocking voltage (v p ) -40 320 310 300 290 280 270 260 250 240 -20 0 20 40 60 80 100
i ntegrated c ircuits d ivision LCC120 www.ixysic.com 7 r09 manufacturing information moisture sensitivity all plastic encapsulated semiconductor packages are susceptible to moisture ingression. ixys integrated circuits division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, ipc/jedec j-std-020 , in force at the time of product evaluation. we test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. this product carries a moisture sensitivity level (msl) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard ipc/jedec j-std-033 . device moisture sensitivity level (msl) rating LCC120 / LCC120s msl 1 esd sensitivity this product is esd sensitive , and should be handled according to the industry standard jesd-625 . reflow profile this product has a maximum body temperature and time rating as shown below. all other guidelines of j-std-020 must be observed. device maximum temperature x time LCC120 / LCC120s 250oc for 30 seconds board wash ixys integrated circuits division recommends the use of no-clean flux formulations. however, board washing to remove flux residue is acceptable. since ixys integrated circuits division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. chlorine- or fluorine-based solvents or fluxes should not be used. cleaning methods that employ ultrasonic energy should not be used. e 3 pb
i ntegrated c ircuits d ivision for additional information please visit our website at: www.ixysic.com 8 LCC120 ixys integrated circuits division makes no representations or warranties with respect to the accuracy or completeness of the co ntents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. neither circuit patent licenses nor indemnity a re expressed or implied. except as set forth in ixys integrated circuits division?s standard terms and conditions of sale, ixys integrated circuits division assumes no liability whatsoever, a nd disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infri ngement of any intellectual property right. the products described in this document are not designed, intended, authorized or warranted for use as components in systems in tended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of ixys integrated circuits division?s product may resul t in direct physical harm, injury, or death to a person or severe property or environmental damage. ixys integrated circuits division reserves the right to discontinue or make changes to its p roducts at any time without notice. specification: ds-LCC120-r09 ?copyright 2012, ixys integrated circuits division optomos ? is a registered trademark of ixys integrated circuits division all rights reserved. printed in usa. 12/22/2012 dimensions mm (inches) user direction of feed notes: 1. dimensions carry tolerances of eia standard 481-2 2. tape complies with all notes for constant dimensions listed on page 5 of eia-481-2 embossment embossed carrier top cover tape thickness 0.102 max. (0.004 max.) 330.2 dia. (13.00 dia.) k 1 =4.20 (0.165) 0 k =4.90 (0.193) p=12.00 (0.472) w=16.00 (0.63) bo=10.30 (0.406) ao=10.30 (0.406) dimensions mm (inches) pcb hole pattern 2.540 0.127 (0.100 0.005) 6.350 0.127 (0.250 0.005) 9.144 0.508 (0.360 0.020) 0.457 0.076 (0.018 0.003) 9.652 0.381 (0.380 0.015) 7.239 typ. (0.285) 7.620 0.254 (0.300 0.010) 4.064 typ (0.160) 0.813 0.102 (0.032 0.004) 8-0.800 dia. (8-0.031 dia.) 2.540 0.127 (0.100 0.005) 7.620 0.127 (0.300 0.005) 7.620 0.127 (0.300 0.005) 6.350 0.127 (0.250 0.005) 3.302 0.051 (0.130 0.002) pin 1 0.254 0.0127 (0.010 0.0005) dimensions mm (inches) pcb land pattern 2.540 0.127 (0.100 0.005) 9.652 0.381 (0.380 0.015) 6.350 0.127 (0.250 0.005) 9.525 0.254 (0.375 0.010) 0.457 0.076 (0.018 0.003) 0.813 0.102 (0.032 0.004) 4.445 0.127 (0.175 0.005) 7.620 0.254 (0.300 0.010) 0.635 0.127 (0.025 0.005) 0.254 0.0127 (0.010 0.0005) 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 0.65 (0.0255) 3.302 0.051 (0.130 0.002) pin 1 mechanical dimensions LCC120 LCC120str tape & reel LCC120s
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